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Recent Progress on the Gold-Free Integration of Ternary III–As Antimonide Nanowires Directly on Silicon

机译:直接在硅片上直接在硅的无黄糖苷纳米线的无黄金整合的进展

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摘要

During the last few years, there has been renewed interest in the monolithic integration of gold-free, Ternary III–As Antimonide (III–As–Sb) compound semiconductor materials on complementary metal-oxide-semiconductor (CMOS)—compatible silicon substrate to exploit its scalability, and relative abundance in high-performance and cost-effective integrated circuits based on the well-established technology. Ternary III–As–Sb nanowires (NWs) hold enormous promise for the fabrication of high-performance optoelectronic nanodevices with tunable bandgap. However, the direct epitaxial growth of gold-free ternary III–As–Sb NWs on silicon is extremely challenging, due to the surfactant effect of Sb. This review highlights the recent progress towards the monolithic integration of III–As–Sb NWs on Si. First, a comprehensive and in-depth review of recent progress made in the gold-free growth of III–As–Sb NWs directly on Si is explicated, followed by a detailed description of the root cause of Sb surfactant effect and its influence on the morphology and structural properties of Au-free ternary III–As–Sb NWs. Then, the various strategies that have been successfully deployed for mitigating the Sb surfactant effect for enhanced Sb incorporation are highlighted. Finally, recent advances made in the development of CMOS compatible, Ternary III–As–Sb NWs based, high-performance optoelectronic devices are elucidated.
机译:在过去几年中,对互补金属氧化物 - 半导体(CMOS)兼容的硅衬底的单片,三元III - 作为锑酸酯(III-AS-SB)化合物半导体材料的单片整合有兴趣基于良好的技术利用其高性能和经济高效的集成电路的可扩展性和相对丰富。三元III-AS-SB纳米线(NWS)对具有可调谐带隙的高性能光电纳米切口的制造具有巨大的承担。然而,由于SB的表面活性剂效应,硅的无金色III-SB NWS的直接外延生长非常具有挑战性。本综述突出了最近迈出了III-AS-SB NWS对SI的单片整合的进展。首先,阐述了直接在Si上无黄金增长的最近进展的全面和深入审查,然后进行了详细描述了Sb表面活性剂效应的根本原因及其对无芳族三元III-SB NWS的形态学和结构性质。然后,突出了已成功部署用于减轻增强SB合并的Sb表面活性剂效果的各种策略。最后,最近在CMOS兼容的发展中进行了最新进展,基于三元III-SB NWS的高性能光电器件。

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