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III-V Lasers and Integrated Components Directly Grown on Silicon: Options for Integration

机译:直接在硅上生长的III-V激光器和集成组件:集成选项

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III-V semiconductor RF and optoelectronic devices have been widely used for decades, primarily in discrete form or low level integration. The conventional wisdom has been that lattice-matched crystal structures must be grown on native substrates with minimal crystalline defects to ensure good device performance and reliability. With limited availability of last-area / low-cost substrates and manufacturing infrastructure, large scale integration of III-V devices, circuits, and system is still in its infancy, compared with Si CMOS. To meet the urgent need for energy-efficient high-performance computing and data-communication components for big data traffic systems, increased adoption and integration of optics and electronics using the fast maturing silicon photonics is essential. Design and implementation of compound semiconductor components on a silicon material platform for photonic and electronic integration is the most logical path forward. This III-V on silicon platform strongly leverages the enormous capabilities and infrastructure of Si CMOS, extending them to photonic and electronic integrated devices/circuits for high speed, wide bandwidth, and energy-efficient applications. Most communication wavelength lasers with excellent device performance being used in Si photonics are grown on III-V substrates and bonded to silicon. For monolithic integration, growth and fabrication of such lasers on III-V/ Si compliant substrates is another option. However, this approach is challenging and was deemed intractable for decades. In this talk, I will briefly describe the development of GaAs/Si and InP/Si compliant substrates on (001) CMOS standard Si substrates for laser growth [1]. $1.3 mumathrm{m}$ and $1.5mu mathrm{m}$ electrically-pump quantum dot lasers have been realized on both types of III-V/Si templates. High-performance and reliable InAs/InGaAs quantum dots (QD) lasers emitting at $1.3 mu mathrm{m}$ grown by MBE on GaAs/Si templates has been well-developed over the past few years [2]. Recently, InAs/InAlGaAs QD lasers on InP/Si templates emitting at either $1.3 mu mathrm{m}$ or $1.5mu mathrm{m}$ have also been demonstrated by MOCVD [3], moving one step closer to make truly monolithic Si photonics a reality.
机译:III-V半导体RF和光电设备已广泛使用了数十年,主要是离散形式或低级集成。传统观点认为,晶格匹配的晶体结构必须在具有最小晶体缺陷的天然衬底上生长,以确保良好的器件性能和可靠性。由于最后区域/低成本衬底和制造基础设施的可用性有限,与Si CMOS相比,III-V器件,电路和系统的大规模集成仍处于起步阶段。为了满足对大数据流量系统的高能效高性能计算和数据通信组件的迫切需求,必须使用快速成熟的硅光子技术来提高对光学和电子器件的采用和集成。在硅材料平台上设计和实现用于光子和电子集成的化合物半导体组件是最合乎逻辑的方法。这款基于硅的III-V平台极大地利用了Si CMOS的强大功能和基础架构,将其扩展至光子和电子集成设备/电路,以实现高速,宽带宽和高能效的应用。硅光子学中使用的大多数具有出色器件性能的通信波长激光器都生长在III-V衬底上,并键合到硅上。对于单片集成,在III-V / Si兼容基板上生长和制造此类激光器是另一种选择。然而,这种方法具有挑战性,几十年来一直被认为是棘手的。在本次演讲中,我将简要介绍在(001)CMOS标准Si衬底上用于激光生长的GaAs / Si和InP / Si兼容衬底的开发[1]。 $ 1.3 \ \ mu \ mathrm { m} $ $ 1.5 \ mu \ mathrm {m } $ 在两种类型的III-V / Si模板上都实现了电泵量子点激光器。高性能和可靠的InAs / InGaAs量子点(QD)激光器 $ 1.3 \ \ mu \ mathrm { m} $ MBE在GaAs / Si模板上生长的金属在过去几年中得到了很好的发展[2]。最近,InP / Si模板上的InAs / InAlGaAs QD激光器在任一位置发射 $ 1.3 \ \ mu \ mathrm { m} $ 或者 $ 1.5 \ mu \ mathrm {m } $ MOCVD [3]也证明了这一点,将其进一步迈近一步,使真正的单片硅光子学成为现实。

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