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The Electronic Transport Channel Protection and Tuning in Real Space to Boost the Thermoelectric Performance of Mg3+δSb2-yBiy near Room Temperature

机译:实际空间中的电子传输通道保护和调谐可提高室温附近Mg3 +δSb2-yBiy的热电性能

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摘要

The optimization of thermoelectric materials involves the decoupling of the transport of electrons and phonons. In this work, an increased Mg -Mg distance, together with the carrier conduction network protection, has been shown as an effective strategy to increase the weighted mobility ( = ) and hence thermoelectric power factor of Mg Sb Bi family near room temperature. Mg Sb Bi has a high carrier mobility of 247 cm  V  s and a record power factor of 3470  W m  K at room temperature. Considering both efficiency and power density, Mg Sb Bi with a high average ZT of 1.13 and an average power factor of 3184  W m  K in the temperature range of 50-250°C would be a strong candidate to replace the conventional n-type thermoelectric material Bi Te Se . The protection of the transport channel through Mg sublattice means alloying on Sb sublattice has little effect on electron while it significantly reduces phonon thermal conductivity, providing us an approach to decouple electron and phonon transport for better thermoelectric materials.
机译:热电材料的优化涉及电子和声子传输的解耦。在这项工作中,增加Mg -Mg的距离以及对载流子传导网络的保护已被证明是一种增加室温下Mg Sb Bi族的加权迁移率(=)并因此提高其热电功率因数的有效策略。 Mg Sb Bi在室温下具有247 cm V s的高载流子迁移率,并且记录的功率因数为3470 W mK。考虑到效率和功率密度,在50-250°C的温度范围内具有高的平均ZT为1.13和平均功率因数为3184 W ofm K的Mg Sb Bi将是替代常规n型热电的强有力的候选者材料碧特色。通过Mg子晶格保护传输通道意味着在Sb子晶格上合金化对电子几乎没有影响,同时显着降低了声子的热导率,为我们提供了一种将电子和声子传输解耦的方法,以获得更好的热电材料。

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