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Modeling Temperature-Dependent Vibration Damping in C/SiC Fiber-Reinforced Ceramic-Matrix Composites

机译:C / SiC纤维增强陶瓷基复合材料中与温度相关的振动阻尼建模

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摘要

In this paper, the temperature-dependent vibration damping in C/SiC fiber-reinforced ceramic-matrix composites (CMCs) with different fiber preforms under different vibration frequencies is investigated. A micromechanical temperature-dependent vibration damping model is developed to establish the relationship between composite damping, material properties, internal damage mechanisms, and temperature. The effects of fiber volume, matrix crack spacing, and interface properties on temperature-dependent composite vibration damping of CMCs and interface damage are analyzed. The experimental temperature-dependent composite damping of 2D and 3D C/SiC composites is predicted for different loading frequencies. The damping of the C/SiC composite increases with temperature to the peak value and then decreases with temperature. When the vibration frequency increases from f = 1 to 10 Hz, the peak value of composite damping and corresponding temperature both decrease due to the decrease of interface debonding and slip range, and the damping of 2D C/SiC is much higher than that of 3D C/SiC at temperature range from room temperature to 400 °C. When the fiber volume and interface debonding energy increase, the peak value of composite damping and the corresponding temperature decreases, mainly attributed to the decrease of interface debonding and slip range.
机译:本文研究了在不同振动频率下具有不同纤维预成型体的C / SiC纤维增强陶瓷基复合材料(CMC)的温度相关振动阻尼。建立了微机械温度相关的振动阻尼模型,以建立复合阻尼,材料性能,内部损伤机理和温度之间的关系。分析了纤维体积,基体裂纹间距和界面特性对CMC随温度变化的复合材料减振和界面损伤的影响。预测了在不同加载频率下2D和3D C / SiC复合材料的实验性温度依赖性复合材料阻尼。 C / SiC复合材料的阻尼随温度升高到峰值,然后随温度降低。当振动频率从f = 1增至10 Hz时,复合阻尼的峰值和相应的温度都会由于界面剥离和滑移范围的减小而降低,并且2D C / SiC的阻尼远高于3D的阻尼。 C / SiC在室温至400°C的温度范围内。当纤维体积和界面剥离能增加时,复合阻尼的峰值和相应的温度降低,这主要归因于界面剥离和滑移范围的减小。

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