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Deposition Kinetics of Thin Silica-Like Coatings in a Large Plasma Reactor

机译:大型等离子反应器中类似二氧化硅薄涂层的沉积动力学

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摘要

An industrial size plasma reactor of 5 m volume was used to study the deposition of silica-like coatings by the plasma-enhanced chemical vapor deposition (PECVD) method. The plasma was sustained by an asymmetrical capacitively coupled radio-frequency discharge at a frequency of 40 kHz and power up to 7 kW. Hexamethyldisilioxane (HMDSO) was introduced continuously at different flows of up to 200 sccm upon pumping with a combination of roots and rotary pumps at an effective pumping speed between 25 and 70 L/s to enable suitable gas residence time in the plasma reactor. The deposition rate and ion density were measured continuously during the plasma process. Both parameters were almost perfectly constant with time, and the deposition rate increased linearly in the range of HMDSO flows from 25 to 160 sccm. The plasma density was of the order of 10 m , indicating an extremely low ionization fraction which decreased with increasing flow from approximately 2 × 10 to 6 × 10 . The correlations between the processing parameters and the properties of deposited films are drawn and discussed.
机译:使用体积为5 m的工业规模等离子体反应器,通过等离子体增强化学气相沉积(PECVD)方法研究了类二氧化硅涂层的沉积。等离子体通过频率为40 kHz且功率高达7 kW的不对称电容耦合射频放电而得以维持。六方二硅六烷(HMDSO)连续以200 sccm的不同流量连续注入,方法是通过根管泵和旋转泵的组合以25至70 L / s的有效泵送速度进行泵送,以确保适当的气体在等离子体反应器中的停留时间。在等离子体过程中连续测量沉积速率和离子密度。两个参数几乎都随时间而完全恒定,并且沉积速率在HMDSO流量从25到160 sccm的范围内线性增加。等离子体密度约为10 m,表明电离度极低,随着流量的增加从2×10减小到6×10。得出并讨论了工艺参数与沉积膜的性能之间的相关性。

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