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The Application of Chemical Polishing in TEM Sample Preparation of Zirconium Alloys

机译:化学抛光在锆合金TEM样品制备中的应用

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摘要

Hydride artefacts are commonly induced by the TEM sample preparation process in Zirconium alloys as hydrogen-sensitive metals, including electron polishing and focused ion beam (FIB) technology. In the research, we present the application of chemical polishing with a solution of 10HF:45HNO :45H O to prepare the disk samples for TEM observation in zirconium alloys. The thinning efficiency of chemical polishing is 25 μm per minute. XRD patterns indicate that the chemical polishing actually eliminates the macro- and micro-stress induced by mechanical grinding. TEM observation demonstrates that chemical polishing reduces the amount of hydride artefacts, especially hydrides with large size. It is proposed that induced stress provides driving force for hydride artefact formation. Compared with traditional mechanical grinding, the advantages of chemical polishing are high efficiency, free of induced stress, less induced hydride artefacts and bend contours.
机译:氢化物伪影通常是由锆合金中的氢敏感金属通过TEM样品制备过程诱发的,其中包括电子抛光和聚焦离子束(FIB)技术。在研究中,我们介绍了在10HF:45HNO:45H O溶液中化学抛光的应用,以制备用于锆合金TEM观察的圆盘样品。化学抛光的减薄效率为每分钟25μm。 X射线衍射图表明化学抛光实际上消除了机械研磨引起的宏观和微观应力。 TEM观察表明,化学抛光减少了氢化物假象的数量,尤其是大尺寸氢化物的数量。提出诱导应力为氢化物假象的形成提供驱动力。与传统的机械研磨相比,化学抛光的优点是效率高,无诱发应力,较少的诱发氢化物伪影和弯曲轮廓。

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