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Facile Process for Surface Passivation Using (NH4)2S for the InP MOS Capacitor with ALD Al2O3

机译:(NH4)2S用于ALD Al2O3的InP MOS电容器的表面钝化工艺

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摘要

Ammonium sulfide ((NH ) S) was used for the passivation of an InP (100) substrate and its conditions were optimized. The capacitance–voltage (C–V) characteristics of InP metal-oxide-semiconductor (MOS) capacitors were analyzed by changing the concentration of and treatment time with (NH ) S. It was found that a 10% (NH ) S treatment for 10 min exhibits the best electrical properties in terms of hysteresis and frequency dispersions in the depletion or accumulation mode. After the InP substrate was passivated by the optimized (NH ) S, the results of x-ray photoelectron spectroscopy (XPS) and the extracted interface trap density (D ) proved that the growth of native oxide was suppressed.
机译:硫化铵((NH)S)用于InP(100)衬底的钝化,并优化了其条件。通过改变(NH)S的浓度和处理时间,分析了InP金属氧化物半导体(MOS)电容器的电容-电压(C–V)特性。结果发现,用10%(NH)S处理就耗尽或累积模式而言,就磁滞和频率分散而言,10分钟表现出最佳的电性能。通过优化的(NH 3)S钝化InP衬底后,X射线光电子能谱(XPS)和提取的界面陷阱密度(D)的结果证明了天然氧化物的生长受到了抑制。

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