Improvements to Wire Bundle Thermal Modeling for Ampacity Determination

摘要

Determining current carrying capacity (ampacity) of wire bundles in aerospace vehicles is critical not only to safety but also to efficient design. Published standards provide guidance on determining wire bundle ampacity but offer little flexibility for configurations where wire bundles of mixed gauges and currents are employed with various external insulation jacket surface properties. Thermal modeling has been employed in an attempt to develop techniques to assist in ampacity determination for these complex configurations. An earlier tool allowed analysis of wire bundle configurations but was constrained to configurations comprised of less than 50 elements. Additionally, for vacuum analyses, configurations with very low emittance external jackets suffered from numerical instability in the solution. A new thermal modeler is presented allowing for larger configurations and is not constrained by low bundle jacket surface infrared emittance calculations. Formulation of key internal radiation and interface conductance parameters is discussed including the effects of temperature and ambient air pressure on wire-to-wire thermal conductance. Test cases comparing model-predicted ampacity and that calculated from standards documents are presented.