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Ion Beam Assisted E-Beam Deposited TiN Microelectrodes—Applied to Neuronal Cell Culture Medium Evaluation

机译:离子束辅助电子束沉积TiN微电极—应用于神经元细胞培养基评估

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摘要

Microelectrode material and cell culture medium have significant roles in the signal-to-noise ratio and cell well-being in in vitro electrophysiological studies. Here, we report an ion beam assisted e-beam deposition (IBAD) based process as an alternative titanium nitride (TiN) deposition method for sputtering in the fabrication of state-of-the-art TiN microelectrode arrays (MEAs). The effects of evaporation and nitrogen flow rates were evaluated while developing the IBAD TiN deposition process. Moreover, the produced IBAD TiN microelectrodes were characterized by impedance, charge transfer capacity (CTC) and noise measurements for electrical properties, AFM and SEM for topological imaging, and EDS for material composition. The impedance (at 1 kHz) of brand new 30 μm IBAD TiN microelectrodes was found to be double but still below 100 kΩ compared with commercial reference MEAs with sputtered TiN microelectrodes of the same size. On the contrary, the noise level of IBAD TiN MEAs was lower compared with that of commercial sputtered TiN MEAs in equal conditions. In CTC IBAD TiN electrodes (3.3 mC/cm2) also outperformed the sputtered counterparts (2.0 mC/cm2). To verify the suitability of IBAD TiN microelectrodes for cell measurements, human pluripotent stem cell (hPSC)-derived neuronal networks were cultured on IBAD TiN MEAs and commercial sputtered TiN MEAs in two different media: neural differentiation medium (NDM) and BrainPhys (BPH). The effect of cell culture media to hPSC derived neuronal networks was evaluated to gain more stable and more active networks. Higher spontaneous activity levels were measured from the neuronal networks cultured in BPH compared with those in NDM in both MEA types. However, BPH caused more problems in cell survival in long-term cultures by inducing neuronal network retraction and clump formation after 1–2 weeks. In addition, BPH was found to corrode the Si3N4 insulator layer more than NDM medium. The developed IBAD TiN process gives MEA manufacturers more choices to choose which method to use to deposit TiN electrodes and the medium evaluation results remind that not only electrode material but also insulator layer and cell culturing medium have crucial role in successful long term MEA measurements.
机译:在体外电生理研究中,微电极材料和细胞培养基在信噪比和细胞健康方面具有重要作用。在这里,我们报告了一种基于离子束辅助电子束沉积(IBAD)的工艺,作为制造最新TiN微电极阵列(MEA)时用于溅射的替代氮化钛(TiN)沉积方法。在开发IBAD TiN沉积工艺时,评估了蒸发和氮气流速的影响。此外,所生产的IBAD TiN微电极的特征在于电性能的阻抗,电荷转移容量(CTC)和噪声测量,用于拓扑成像的AFM和SEM以及用于材料成分的EDS。发现与具有相同尺寸的溅射TiN微电极的商业参考MEA相比,全新的30μmIBAD TiN微电极的阻抗(在1 kHz下)是原来的两倍,但仍低于100kΩ。相反,在相同条件下,IBAD TiN MEA的噪声水平低于商用溅射TiN MEA的噪声水平。在CTC IBAD TiN电极(3.3 mC / cm 2 )中,其溅射性能也优于溅射电极(2.0 mC / cm 2 )。为了验证IBAD TiN微电极对细胞测量的适用性,将人类多能干细胞(hPSC)衍生的神经元网络在IBAD TiN MEA和商用溅射TiN MEA上的两种不同培养基中进行培养:神经分化培养基(NDM)和BrainPhys(BPH) 。评价了细胞培养基对hPSC衍生的神经元网络的作用,以获得更稳定和更活跃的网络。在两种MEA类型中,从BPH培养的神经元网络测量到的自发活性水平均高于NDM。但是,BPH在1-2周后通过诱导神经元网络收缩和团块形成,在长期培养中引起更多的细胞存活问题。另外,发现BPH比NDM介质腐蚀Si3N4绝缘体层的程度更大。发达的IBAD TiN工艺为MEA制造商提供了更多选择,以选择使用哪种方法来沉积TiN电极,并且介质评估结果提醒着,不仅电极材料而且绝缘体层和细胞培养基在成功的长期MEA测量中都起着关键作用。

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