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Scaled-Down c-Si and c-SiGe Wagon-Wheels for the Visualization of the Anisotropy and Selectivity of Wet-Chemical Etchants

机译:按比例缩小的c-Si和c-SiGe车轮用于可视化湿化学腐蚀剂的各向异性和选择性

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摘要

Wet etching offers an advantage as a soft, damage-less method to remove sacrificial material with close to nanometer precision which has become critical for the fabrication of nanoscale structures. In order to develop such wet etching solutions, screening of etchant properties like selectivity and (an)isotropy has become vital. Since these etchants typically have low etch rates, sensitive test structures are required to evaluate their etching behavior. Therefore, scaled-down single-crystalline Si (c-Si) and SiGe (c-SiGe) wagon-wheels were fabricated. First, the sensitivity of the c-Si wagon-wheels to detect anisotropic behavior of crystalline silicon in the alkaline etchants TMAH and NH4OH was demonstrated. Distinctive wagon-wheel patterns, characteristic for each material/etchant pair, were observed by top-down scanning electron microscopy (SEM) after anisotropic wet etching. Similar trends in crystallographic plane-dependent etch rates were obtained for both Si(100) and Si(110) substrates. Secondly, the etching of both c-Si and c-Si75Ge25 wagon-wheels in a typical selective etchant, peracetic acid (PAA), was evaluated. c-Si75Ge25 etching in PAA resulted in isotropic etching. Selectivity values were calculated based on two methods: the first by measurement of the sidewall loss of the spokes of the wagon-wheel, the second, indirect method, through measurement of the spoke retraction lengths. Both methods give comparable values, but the latter method can only be used after a certain critical etching time, after which the spoke tips have evolved toward a sharp tip.Electronic supplementary materialThe online version of this article (10.1186/s11671-019-3114-8) contains supplementary material, which is available to authorized users.
机译:湿法刻蚀作为一种柔软,无损伤的方法具有优势,可以以接近纳米的精度去除牺牲材料,这对制造纳米级结构至关重要。为了开发这种湿法蚀刻溶液,对诸如选择性和(各向同性)性等蚀刻剂性质的筛选变得至关重要。由于这些蚀刻剂通常具有低蚀刻速率,因此需要灵敏的测试结构来评估其蚀刻行为。因此,制造了按比例缩小的单晶硅(c-Si)和SiGe(c-SiGe)车轮。首先,证明了c-Si车轮对检测碱性蚀刻剂TMAH和NH4OH中晶体硅的各向异性行为的敏感性。在各向异性湿法刻蚀之后,通过自上而下的扫描电子显微镜(SEM)观察到每种材料/刻蚀剂对所特有的独特车轮图案。对于Si(100)和Si(110)衬底,都获得了与晶面相关的蚀刻速率相似的趋势。其次,评估了在典型的选择性蚀刻剂过乙酸(PAA)中对c-Si和c-Si75Ge25车轮的蚀刻。 PAA中的c-Si75Ge25蚀刻导致各向同性蚀刻。选择性值是根据两种方法计算的:第一种方法是通过测量车轮辐条的侧壁损失;第二种是间接方法,通过测量辐条缩进长度。两种方法都具有可比较的值,但是后一种方法只能在一定的关键蚀刻时间之后使用,之后辐条尖端会朝着尖锐的尖端发展。电子补充材料本文的在线版本(10.1186 / s11671-019-3114- 8)包含补充材料,授权用户可以使用。

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