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Fast sintering of silver nanoparticle and flake layers by infrared module assistance in large area roll-to-roll gravure printing system

机译:红外模块辅助在大面积卷对卷凹版印刷系统中快速烧结银纳米颗粒和薄片层

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摘要

We present fast sintering for silver (Ag) nanoparticle (NP) and flake layers printed using roll-to-roll (R2R) gravure printing. An infrared (IR) sintering module was applied to an R2R system to shorten the sintering duration of an R2R gravure-printed Ag layer. IR sintering of the conductive layer was improved by optimising the process condition. After printing of the Ag NP and Ag flake layers, additional IR sintering was performed in the R2R system. The lowest sheet resistance obtained in the Ag NP layer was 0.294 Ω/□, the distance between the substrate and lamp was 50-mm long, the IR lamp power was 500 W, and the sintering time was 5.4 s. The fastest sintering of 0.34 Ω/□ was achieved with 50-mm distance, 1,000-W IR lamp power, and 1.08-s sintering time. In the Ag flake layer, the lowest sheet resistance obtained was 0.288 Ω/□ with a 20-mm distance, 1,000-W IR lamp power, and 10.8-s sintering time. Meanwhile, the fastest sintering was obtained with a 3.83 Ω/□ sheet resistance, 20-mm distance, 1000-W IR lamp, and 1.08-s sintering time. Thus, the IR sintering module can easily be employed in an R2R system to obtain excellent layer sheet resistance.
机译:我们介绍了使用卷对卷(R2R)凹版印刷技术印刷的银(Ag)纳米颗粒(NP)和薄片层的快速烧结方法。将红外(IR)烧结模块应用于R2R系统,以缩短R2R凹版印刷Ag层的烧结时间。通过优化工艺条件,改善了导电层的红外烧结。在印刷Ag NP和Ag薄片层之后,在R2R系统中进行了额外的IR烧结。在Ag NP层中获得的最低薄层电阻为0.294Ω/□,基板和灯之间的距离为50mm长,IR灯功率为500,W,烧结时间为5.4 s。 50mm的距离,1,000W的红外灯功率和1.08s的烧结时间实现了0.340.3Ω/□的最快烧结。在Ag薄片层中,获得的最低薄层电阻为0.288Ω/□,间距为20mm,IR灯功率为1000W,烧结时间为10.8s。同时,以3.83Ω/□的薄层电阻,20毫米的距离,1000瓦的IR灯和1.08秒的烧结时间获得了最快的烧结速度。因此,IR烧结模块可以容易地用于R2R系统中以获得优异的层片电阻。

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