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Nucleation and growth of TiAl3 intermetallic phase in diffusion bonded Ti/Al Metal Intermetallic Laminate

机译:Ti / Al金属间金属薄板中TiAl3金属间相的形核与生长

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摘要

A novel nucleation and growth phenomenon for TiAl3 intermetallic phase in Ti/Al diffusion couple is proposed based on diffusion kinetics. The interdiffusion and intrinsic diffusion co-efficients are calculated to make evident of dominant diffusion of Al towards Ti in Ti/Al diffusion couple obtained by solid state diffusion bonding. It was surprising to observe that the diffusion rate of Al was around 20 times higher than Ti with the formation of Kirkendall pores near the Al/TiAl3 interface. With such dominant diffusion of Al towards Ti, the nucleation and growth of TiAl3 intermetallic phase in Ti/Al couple happens mainly at the Ti/TiAl3 interface rather than Al/TiAl3 interface which is evident by the presence of very fine nearly nano-sized TiAl3 nuclei/grains near the Ti/TiAl3 interface. Even though the intermetallic phase is expected to nucleate at Al/TiAl3 interface, the relatively larger TiAl3 grains near that interface depicts grain growth with minimal nucleation. The theoretical calculations on diffusion parameters are in accordance with experimental observations of TiAl3 intermetallic growth phenomenon in Ti/Al system.
机译:基于扩散动力学,提出了Ti / Al扩散对中TiAl3金属间相的新形核和生长现象。计算互扩散系数和本征扩散系数,以证明通过固态扩散键合获得的Ti / Al扩散对中Al向Ti的主要扩散。令人惊讶的是,在Al / TiAl3界面附近形成了Kirkendall孔,Al的扩散速率比Ti高出20倍左右。由于Al向Ti的这种主要扩散,Ti / Al对中TiAl3金属间相的形核和生长主要发生在Ti / TiAl3界面而不是Al / TiAl3界面,这可以通过存在非常细小的近乎纳米尺寸的TiAl3来证明。 Ti / TiAl3界面附近的晶核/晶粒。即使金属间相预计会在Al / TiAl3界面成核,但在该界面附近相对较大的TiAl3晶粒仍会以最小的成核现象描述晶粒的生长。扩散参数的理论计算与Ti / Al体系中TiAl3金属间生长现象的实验观察一致。

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