首页> 外文期刊>Scientific reports. >Nucleation and growth of TiAl 3 intermetallic phase in diffusion bonded Ti/Al Metal Intermetallic Laminate
【24h】

Nucleation and growth of TiAl 3 intermetallic phase in diffusion bonded Ti/Al Metal Intermetallic Laminate

机译:扩散键合Ti / Al金属金属间层压板中TiAl 3金属间相的成核和生长

获取原文
获取外文期刊封面目录资料

摘要

A novel nucleation and growth phenomenon for TiAl3 intermetallic phase in Ti/Al diffusion couple is proposed based on diffusion kinetics. The interdiffusion and intrinsic diffusion co-efficients are calculated to make evident of dominant diffusion of Al towards Ti in Ti/Al diffusion couple obtained by solid state diffusion bonding. It was surprising to observe that the diffusion rate of Al was around 20 times higher than Ti with the formation of Kirkendall pores near the Al/TiAl3 interface. With such dominant diffusion of Al towards Ti, the nucleation and growth of TiAl3 intermetallic phase in Ti/Al couple happens mainly at the Ti/TiAl3 interface rather than Al/TiAl3 interface which is evident by the presence of very fine nearly nano-sized TiAl3 nuclei/grains near the Ti/TiAl3 interface. Even though the intermetallic phase is expected to nucleate at Al/TiAl3 interface, the relatively larger TiAl3 grains near that interface depicts grain growth with minimal nucleation. The theoretical calculations on diffusion parameters are in accordance with experimental observations of TiAl3 intermetallic growth phenomenon in Ti/Al system.
机译:基于扩散动力学,提出了TiAl3漫射耦合中TiAl3金属间相的新型成核和生长现象。计算间隔和内在扩散共效,以在通过固态扩散键合获得的Ti / Al扩散夫妇中对Ti的显性扩散显着。令人惊讶的是,观察到Al / TiAl3接口附近的Kirkendall孔的形成,Al的扩散率约为Ti的20倍。通过Al朝向Ti的显性扩散,TiAl3金属间相的成核和生长在Ti / Al耦合中主要发生在Ti / TiAl3接口中而不是Al / TiAl3接口,这通过非常精细的几乎纳米大小的TiAl3显而易见Ti / TiAl3接口附近的核/颗粒。尽管预期金属间相对于Al / TiA13界面预期成核,但该界面附近的相对较大的TiAl3颗粒也描绘​​了具有最小成核的晶粒生长。扩散参数的理论计算符合TiAl3金属间生长现象在Ti / Al系统中的实验观察。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号