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CMOS compatible high-Q photonic crystal nanocavity fabricated with photolithography on silicon photonic platform

机译:在硅光子平台上通过光刻技术制造的CMOS兼容高Q光子晶体纳米腔

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摘要

Progress on the fabrication of ultrahigh-Q photonic-crystal nanocavities (PhC-NCs) has revealed the prospect for new applications including silicon Raman lasers that require a strong confinement of light. Among various PhC-NCs, the highest Q has been recorded with silicon. On the other hand, microcavity is one of the basic building blocks in silicon photonics. However, the fusion between PhC-NCs and silicon photonics has yet to be exploited, since PhC-NCs are usually fabricated with electron-beam lithography and require an air-bridge structure. Here we show that a 2D-PhC-NC fabricated with deep-UV photolithography on a silica-clad silicon-on-insulator (SOI) structure will exhibit a high-Q of 2.2 × 105 with a mode-volume of ~1.7(λ)3. This is the highest Q demonstrated with photolithography. We also show that this device exhibits an efficient thermal diffusion and enables high-speed switching. The demonstration of the photolithographic fabrication of high-Q silica-clad PhC-NCs will open possibility for mass-manufacturing and boost the fusion between silicon photonics and CMOS devices.
机译:超高Q光子晶体纳米腔(PhC-NC)的制造进展显示出新应用的前景,包括需要强光限制的硅拉曼激光器。在各种PhC-NC中,硅的Q值最高。另一方面,微腔是硅光子学的基本组成部分之一。但是,PhC-NC和硅光子之间的融合尚待开发,因为PhC-NC通常是用电子束光刻制造的,并且需要气桥结构。在这里,我们显示了用深紫外光刻技术在包覆有二氧化硅的绝缘体上硅(SOI)结构上制造的2D-PhC-NC的高Q值为2.2×10 5 ,模式体积约为1.7(λ/ n) 3 。这是光刻技术所显示的最高Q。我们还表明,该器件表现出有效的热扩散并能够实现高速开关。高Q包覆二氧化硅的PhC-NC光刻制造的演示将为大规模制造打开可能性,并促进硅光子学与CMOS器件之间的融合。

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