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High-speed X-ray imaging pixel array detector for synchrotron bunch isolation

机译:用于同步加速器束隔离的高速X射线成像像素阵列检测器

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摘要

A wide-dynamic-range imaging X-ray detector designed for recording successive frames at rates up to 10 MHz is described. X-ray imaging with frame rates of up to 6.5 MHz have been experimentally verified. The pixel design allows for up to 8–12 frames to be stored internally at high speed before readout, which occurs at a 1 kHz frame rate. An additional mode of operation allows the integration capacitors to be re-addressed repeatedly before readout which can enhance the signal-to-noise ratio of cyclical processes. This detector, along with modern storage ring sources which provide short (10–100 ps) and intense X-ray pulses at megahertz rates, opens new avenues for the study of rapid structural changes in materials. The detector consists of hybridized modules, each of which is comprised of a 500 µm-thick silicon X-ray sensor solder bump-bonded, pixel by pixel, to an application-specific integrated circuit. The format of each module is 128 × 128 pixels with a pixel pitch of 150 µm. In the prototype detector described here, the three-side buttable modules are tiled in a 3 × 2 array with a full format of 256 × 384 pixels. The characteristics, operation, testing and application of the detector are detailed.
机译:描述了一种宽动态范围成像X射线探测器,该探测器设计用于以高达10 MHz的速率记录连续的帧。 X射线成像的帧速率高达6.5 MHz已通过实验验证。像素设计允许在读出之前以1 kHz的帧速率在内部高速存储多达8–12帧。另一种工作模式允许积分电容器在读出之前反复重新寻址,这可以增强循环过程的信噪比。该探测器与现代存储环源一起以兆赫兹的频率提供短(10–100 ps)和强X射线脉冲,为研究材料的快速结构变化开辟了新途径。该检测器由混合模块组成,每个模块均由一个500μm厚的硅X射线传感器焊料点焊到一个专用集成电路,每个像素点焊。每个模块的格式为128×128像素,像素间距为150 µm。在这里描述的原型检测器中,三边可伸缩模块以3×2阵列平铺,具有256×384像素的完整格式。详细介绍了该探测器的特性,操作,测试和应用。

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