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Influence of Cu Content on the Microstructure and Mechanical Properties of Cr-Cu-N Coatings

机译:铜含量对Cr-Cu-N涂层微观结构和力学性能的影响

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摘要

The Cr-Cu-N coatings with various Cu contents (0–25.18 (±0.17) at.%) were deposited on Si wafer and stainless steel (SUS 304) substrates in reactive Ar+N2 gas mixture by a hybrid coating system combining pulsed DC and RF magnetron sputtering techniques. The influence of Cu content on the coating composition, microstructure, and mechanical properties was investigated. The microstructure of the coatings was significantly altered by the introduction of Cu. The deposited coatings exhibit solid solution structure with different compositions in all of the samples. Addition of Cu is intensively favored for preferred orientation growth along (200) direction by restricting in (111) direction. With increasing Cu content, the surface and cross-sectional morphology of coatings were changed from triangle cone-shaped, columnar feature to broccoli-like and compact glassy microstructure, respectively. The mechanical properties including the residual stress, nanohardness, and toughness of the coatings were explored on the basis of Cu content. The highest hardness was obtained at the Cu content of 1.49 (±0.10) at.%.
机译:通过脉冲混合的混合涂层系统,将具有不同Cu含量(0–25.18(±0.17)at。%)的Cr-Cu-N涂层以反应性Ar + N2气体混合物的形式沉积在Si晶片和不锈钢(SUS 304)衬底上直流和射频磁控溅射技术。研究了铜含量对涂层组成,微观结构和力学性能的影响。铜的引入大大改变了涂层的微观结构。所沉积的涂层在所有样品中均表现出具有不同组成的固溶体结构。通过在(111)方向上进行限制,强烈优选沿着(200)方向生长优选地添加Cu。随着Cu含量的增加,涂层的表面和截面形貌分别从三角形,柱状变为花椰菜状和致密的玻璃状微观结构。基于铜含量,研究了涂层的机械性能,包括残余应力,纳米硬度和韧性。在1.49(±0.10)%at。%的Cu含量下可获得最高的硬度。

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