【2h】

Self-assembled single-crystal silicon circuits on plastic

机译:在塑料上自组装的单晶硅电路

代理获取
本网站仅为用户提供外文OA文献查询和代理获取服务,本网站没有原文。下单后我们将采用程序或人工为您竭诚获取高质量的原文,但由于OA文献来源多样且变更频繁,仍可能出现获取不到、文献不完整或与标题不符等情况,如果获取不到我们将提供退款服务。请知悉。

摘要

We demonstrate the use of self-assembly for the integration of freestanding micrometer-scale components, including single-crystal, silicon field-effect transistors (FETs) and diffusion resistors, onto flexible plastic substrates. Preferential self-assembly of multiple microcomponent types onto a common platform is achieved through complementary shape recognition and aided by capillary, fluidic, and gravitational forces. We outline a microfabrication process that yields single-crystal, silicon FETs in a freestanding, powder-like collection for use with self-assembly. Demonstrations of self-assembled FETs on plastic include logic inverters and measured electron mobility of 592 cm2/V-s. Finally, we extend the self-assembly process to substrates each containing 10,000 binding sites and realize 97% self-assembly yield within 25 min for 100-μm-sized elements. High-yield self-assembly of micrometer-scale functional devices as outlined here provides a powerful approach for production of macroelectronic systems.
机译:我们演示了使用自组装将独立的微米级组件(包括单晶硅,硅场效应晶体管(FET)和扩散电阻)集成到柔性塑料基板上的方法。通过互补的形状识别,并在毛细管力,流体力和重力的作用下,可以将多种微组件类型优先自组装到一个公共平台上。我们概述了一种微细加工工艺,该工艺可产生独立的,粉末状的单晶硅FET,并用于自组装。塑料上的自组装FET的演示包括逻辑反相器和测得的592 cm 2 / V-s的电子迁移率。最后,我们将自组装过程扩展到每个包含10,000个结合位点的基板,并在25分钟内实现100μm尺寸元件的97%自组装产率。此处概述的微米级功能器件的高产量自组装为生产宏电子系统提供了一种有力的方法。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
代理获取

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号