首页> 中文期刊> 《真空电子技术》 >耦合腔行波管复合腔片真空扩散焊工艺研究

耦合腔行波管复合腔片真空扩散焊工艺研究

         

摘要

Microware vacuum electron devices are widely used in radar,satellite communication,medical treatment,etc.Composite chamber piecesare very important parts of CCTWTs,and their qualities determine whether the TWTs can work effectively.This paper presents a diffusion welding preparation process of the composite chamber piecesfor CCTWTs.With this process,the composite chamber pieces haveno obvious deformation,and can meet thedimensional precisionrequirements of 2nd finish machining.The SEM and EDS analysis all showed that the diffusion interface was straight,and there was no "dead space".The tensile strength of the composite chamber piecescan reach 210 MPa,and the leak rate is less than 10 11 Pa · m3/s.Vacuum deterioration in the tube resulted from solderevaporation and gas release from the inner wall was solved and therefore the service life of the device was improved.%微波真空电子器件广泛应用于雷达、卫星导航以及医疗等方面.复合腔片作为耦合腔行波管中的重要件,其制备工艺质量决定了整管能否稳定可靠工作.本文研究了耦合腔行波管复合腔片真空扩散焊制备工艺,采用该工艺,复合腔片无明显变形,满足二次精加工尺寸精度;并采用扫描电镜结合能量色散谱分析发现,扩散界面平直、没有“死空间”等缺陷;抗拉强度达到210 MPa以上;漏气率小于10-11 Pa·m3/s;解决了焊料蒸发以及零件内壁和内壁气体迁移到管内,而降低管内真空度问题,提升了器件寿命.

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