制备铝基复合基板真空室的结构设计

摘要

铝基复合基板是一种大功率模块芯片理想的散热基板,在非真空环境下高温热压制备容易出现氧化腐蚀等问题,造成基板致密度不高,无法满足芯片匹配要求,设计了一种供在真空热电挤压下制备铝基复合基板的真空室.通过对真空室形状大小的确定、材料的选择、壁厚的计算,设计完成满足制备基板工艺的真空室结构以及静、动态密封结构.通过ANSYS有限元分析软件对真空室结构进行计算机仿真,分析其最大应力应变处,满足真空室基本强度刚性要求,从而为真空热电挤压制备铝基复合基板创造了一个密封、稳定的真空制备环境.%Aluminum composite substrate is an ideal cooling substrate for high-power module chip,the preparation of Aluminum Composite Substrate often appears oxidation corrosion in the non-vacuum environment,which results in low density substrate that can not match chip. This paper presents a vacuum chamber for the preparation of Aluminum Com-posite Substrate. Based on the shape,size and material selection made of vacuum chamber and wall thickness calculation, the structure of vacuum chamber was completed and its static and dynamic seal structure was designed. The maximum stress and deformation of vacuum chamber was simulated and analyzed by ANSYS software for meeting the strength and rigidity of the vacuum chamber,which created a sealed and stable environment for preparation of Aluminum Composite Substrate by vacuum thermo-electric extrusion.