针对五种不同拓扑结构的混合整流器原理进行分析,建立构成混合整流器的无源器件、半导体芯片、散热系统和辅助元件模块关于损耗、体积和质量模型.采用非支配遗传算法Ⅱ(NSGA-Ⅱ)在给定系统和模块的参数条件下,求解由电感器、电容器、MOSFET管和二极管构成的半导体模块,风机和散热器构成的散热系统以及控制板、驱动器和辅助电源模块构成的辅助模块的损耗、体积和质量.依据得出的数据建立相对效率、功率密度、功率质量比、无源器件相对损耗、半导体芯片相对面积性能指标,得到不同开关频率性能指标之间关系和比较结果.在不同开关频率时,根据模型求解的数据和性能指标比较图,综合比较五种不同拓扑结构的混合整流器系统性能指标,得出三电平单向Vienna型混合整流器(3LUVHR)系统性能最优.%The operating principles of five different hybrid rectifier topologies are analyzed in this paper. The hybrid rectifier is composed of passive components, semiconductor chips, cooling system and auxiliary component modules. Herein, passive components consist of inductor and capacitor, semiconductor module is made of MOSFET and diode, cooling system consists of the fan and heat sink, and auxiliary component is composed of control panel, the gate driver and the auxiliary power supply. The models of power loss, volume and mass for the hybrid rectifier are set up. Given system and module parameters, NSGA-II is used to solve these models. The diagrams of performance relation and comparison can be drawn under different switch frequencies. The performance indexes are compared comprehensively among five different hybrid rectifiers. It is shown that the system performance of three-level unidirectional Vienna hybrid rectifier (3LUVHR) is optimal.
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