新型复合铝基钎料的制备及性能

摘要

Al-Si合金钎料的共晶温度为577℃,钎焊温度与铝的固相线温度较接近,为了避免在铝合金焊接中产生晶粒长大、熔蚀等缺陷现象，本文通过在Al-Si合金钎料表面上镀铜的方法制备出形式为Cu/Al-Si/Cu新型复合铝基薄带钎料。应用差热分析法（DTA）、润湿性实验、力学性能和金相组织等方法，分析制备新型复合铝基复合钎料的性能，结果表明：新型复合钎料与传统Al-Si钎料相比，固液相线温度显著降低，同时具有良好的润湿性能，并具有理想的机械性能。%Al-Si alloy eutectic solder temperature is 577 ℃, aluminum brazing temperature and the temperature close to solidus, in order to avoid welding of aluminum alloy produced in the grain growth, the defects such as ablation, this article in Al-Si solder alloy by adding elements of the basis of Cu, using Al-Si alloy solder copper surface prepared a form of Cu / Al-Si / Cu aluminum matrix composite solder strip. The use of differential thermal analysis (DTA), wetting by means of experiment, analysis prepared by the new aluminum-based composite solder performance, found that preparation of a new type of filler metal with the traditional Al-Si filler metal as compared to solid-liquid phase line temperature drop, while the new solder with good wetting properties, and has ideal mechanical properties.