浅谈LED封装键合线的选用及趋势

摘要

LED packaging technology are mainly involves packaging design, packaging materials, packaging equipment, packaging pro-cess, packaging craft the five aspects. With the improvement of the light efficiency, reducing cost is one of the technical bottlenecks encoun-tered in the LED packaging market.The key element to solve this problem is to decided by the selection of the welding line. This paper gives research on the packaging market in major types of welding line, analysis the main factors affecting the bonding wire process in detail, contrasts the advantages and disadvantages of all kinds of alloy line wire bonding process, gives summary the scope of application alloy wire, and briefly analysis the development trend of the selection of the welding line.%LED封装技术主要涉及到封装设计、封装材料、封装设备、封装过程、封装工艺五大方面。其中，封装材料的选择会影响LED封装产品的合格率、可靠性、热学特性及光学特性等。因此，如何提高光效、降低成本是目前LED封装市场遇到的技术瓶颈之一，而解决这一问题的重要原因在于键合线的选取。文章中对封装市场中所用键合线的主要种类进行调研，详细分析了焊线过程中影响键合的主要原因，对比生产焊线过程中各类键合线的利弊，总结出键合线的应用范围，并对焊接线选取的发展趋势简单分析。