首页> 中文期刊> 《有机硅材料》 >非粘接型耐高温有机硅密封材料的性能研究

非粘接型耐高温有机硅密封材料的性能研究

         

摘要

以聚硅氮烷为基体树脂,硅氧烷为增韧剂和浸润剂,云母粉、硅藻土、碳化硼为填料,制备了耐600℃高温的非粘接型密封材料,该密封材料经室温~600℃热循环24次后,密封压力达到4 MPa;以聚硅氮烷为基体树脂,二硅化钼、云母粉、滑石粉、二氧化硅为填料,制备了耐800℃高温的非粘接型密封材料,该密封材料经室温~800℃热循环24次后,密封压力达到4 MPa.%The non-adhesive sealant for high temperature resistant of 600℃ was prepared with mixture of silazane as matrix resin, siloxane as toughness reagent, impregnant, and corresponding fillers (including mi-ca , boron carbide and diatomite). The sealant could bear the pressure up to 4 MPa after twenty four circles between room temperature to 600℃. Meanwhile, the non-adhesive sealant for 800℃ was prepared by mixing of silazane as matrix resin, siloxane as toughness reagent, impregnant, and corresponding fillers (including mica, silicon dioxide, molybdenum disilicide, and talcum powder). The sealant could bear the pressure up to 4 MPa after twenty four circles between room temperature to 800℃.

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