基于 DOE/SPC 的锡浆厚度波动分析及优化

摘要

During the whole process of product quality con-trol, DOE plays a very importent role. It is a guarantee of prod-uct quality improvement and process improvement. The paper introduces how to application tool Successfully by quantitative a-nalysis of process parameters. The problem of the thickness fluc-tuation of solder paste is solved, DPU ware Significantly re-duced, Process quality has been significantly improved.%在产品质量控制的整个过程中，试验设计(DOE)扮演了非常重要的角色，是提高产品质量及工艺流程改善的重要保证。本文通过对产品质量、工艺参数的量化分析，成功应用 SPC 工具，解决了锡浆厚度波动的问题，使得前线缺陷水平(DPU)明显减少，工序质量得到了明显提高。