高层厚孔铜产品制作流程优化探讨

摘要

The article is aiming at investigating one production method for holes 70μm copper products to optimize processes,achieve hole copper over 70μm and can efficiently control the thickness of plating copper under 75μm to reduce the difficulty of etching by the relative isolated,fine lines.In this paper,for the following types of implementations： plated hole＋positives,false negatives,negative＋figure plating,negative sum up the assessment process,and ultimately determine the negative＋figure plated as the best process for Division I,while the products meet the performance indicators and customer requirements.%探究一种针对孔铜为70μm产品的制作方法,以优化流程,实现孔铜控制在70μm以上,蚀刻底铜控制在75μm以下,以减低相对孤立、细小线路的制作对蚀刻带来的难度。主要针对以下几类实现方式：镀孔＋正片,假负片,负片＋图镀,负片过程进行总结评估,最终确定负片＋图镀为适合我司的最佳流程,同时,产品各指标性能符合客户要求。