高可靠性18层刚挠结合印制板制作技术研究

摘要

文章通过介绍一款用于航空方面的18层高可靠性刚挠结合印制板在压合、盲槽制作、半固化片开窗、覆盖膜压合等技术点的突破,提出一套适用于此类高层高阶刚挠结合印制板的制作技术。%By taking a high reliability eighteen-layer flex-rigid PCB as an example, this paper studies on the manufacturing technology of lamination, blind slot, prepreg window and cover layer so as to bring forward the technology to manufacture such kind of multilayer and high-step flex-rigid PCB.