含填料酚醛固化体系覆铜板用半固化片流变特性研究

摘要

含填料的酚醛固化体系是目前环氧树脂基覆铜板的主流。本文采用旋转流变仪研究了填料种类、填料形态、填料比例以及阴离子分散剂对酚醛固化体系覆铜板用半固化片流变特性的影响。%Phenolic novolac curing system containing filler is the dominating technology for Copper Clad Laminate based on epoxy resin currently. The infiuence of the filler type, the filler shape, the filler ratio and the anionic dispersant on the rheological properties of prepreg used in copper clad laminate were investigated in this paper.