镍镀层表面薄金镀层的焊接特性研究

摘要

本文对电子产品天线或者印刷线路板中的镍镀层表面的薄镀金层,由于镀金层薄存在孔隙,在产品焊接过程中产生了表面焊点润湿不良的缺陷而影响焊接性能的过程进行了研究.通过对镀镍表面薄镀金层表面的金属做金属溶胶水溶液封闭润湿性处理,可以有效改善镍镀层上镀金层的表面接触角和微观形貌,镀薄金层的表面焊接性能也得到提高.%Due to the existence of gap on the thin gold coating on nickel coating surface of the electronic product antenna or printed circuit board,poor wetting of surface solder joints might occur during the welding process,which will further affect the welding performance.In view of this problem,a detailed study was carried out in this paper.The surface contact angle and micromorphology of gold coating on nickel plating layer could be effectively improved through sealing and wetting the metal with sol aqueous solution,and the surface welding performance of the thin gold coating could also be improved.