探究一种无敏化和活化过程的石墨粉化学镀铜新工艺。研究石墨粉分别在酒石酸钾钠单络合剂、EDTA·Na2单络合剂、酒石酸钾钠和EDTA·Na2的双络合剂3种镀液配方中的化学镀铜行为，以及温度对镀层外观、镀覆速率、镀覆前后质量增加率的影响，并采用 SEM 分析方法表征施镀前后的石墨粉微观形貌。结果表明：石墨粉无敏化、活化处理条件下，可镀覆上完整的铜层。施镀反应在镀液pH值为12.5，甲醛浓度为35 mL/L条件下进行。镀覆温度为75℃，络合剂配方选择在乙二胺四乙酸二钠浓度c(EDTA·Na2)为30 g/L时，镀覆速率1.32 g/h，镀覆效果最佳。镀覆后的石墨粉外观呈玫红色，且镀层连续致密。%A novel technology of electroless copper coating on graphite powders was developed without sensitization and activation treatment. Three kinds of bath agent were tested: potassium sodium tartrate, EDTA×Na2, and a mixture of these two agents. The effects of reaction temperature on the microstructure, deposition speed and mass growth rate of Cu-coatings were studied. SEM was used to characterize the micro morphology of Cu-coated powders. The results show that the electroless copper coatings can be produced on graphite powders without sensitizing and activating treatments. The experiments are carried out in the plating solution, with a pH value of 12.5 and a CHCHO concentration of 35 mL/L. The graphite powders with a consecutive, compact and rosyredcolor Cu coating can be obtained at 75℃ with EDTA×Na2concentration of 30 g/L.
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