KDP晶体精密切割机设计及其切割表面质量影响因素分析

摘要

KDP晶体具有较大的非线性光学系数和较高的激光损伤阈值,但具有易潮解和软脆特性,需要采用精密金刚石线切割实现其坯料的快速切割.基于电镀金刚石环线技术,设计了一种用于KDP晶体快速精密切割设备,能够实现切割张紧力可控可调;采用正交试验方法对200mm×200 mm的晶体进行切割试验,并通过灰色理论对影响工件平面度和粗糙度的各工艺参数,进行了动态、量化分析,试验得出各工艺因素对切割表面质量影响程度大小,确定了环线切割的最佳工艺参数.%KDP crystal has larger nonlinear optical coefficient and higher laser damage threshold,however,it has deliquescent and softly brittle characteristics,precision diamond wire sawing technology could be used to achieve fast and precision blank specimen cutting.Based on diamond plating looped wire technology,a fast and precise cutting machine for KDP crystal is designed,tension force of the loop wire was numerically controllable and adjustable;by means of orthogonal test,the cutting experiment of 200 mm × 200 mm KDP crystal was carried out.Using gray theory,the dynamic and quantitative analysis is conducted to investigate the process parameters' effects towards the flatness and roughness of the workpiece.The experiments determined the influence of various process factors on the surface cutting quality,and the optimum process parameters for the loop cutting are concluded as well.