焊接工艺对TPI单轴拉伸力学性能的影响

摘要

To study the mechanical properties of the thermoplastic polyimides ( TPI) films, uniaxial tensile tests were conducted in TPI base films ( M50 ) and two different TPI welding films ( C50 and T50). The results showed that the yield stresses of M50, C50 and T50 were 40. 1 MPa, 34. 4 MPa and 39. 6 MPa, respectively. The tensile strength and the elastic modulus of TPI base films and welding films were similar. The yield stress of TPI welding films was influenced by the welding tem-perature while the effects of welding technology on the tensile strength and the elastic modulus of TPI welding films were not significant.%为研究热塑性聚酰亚胺(TPI)薄膜的力学性能,对其母材试件(M50)和两种不同焊接工艺的焊接薄膜试件(C50、T50)进行单轴拉伸试验.试验结果与分析表明:TPI薄膜母材M50的屈服强度约为40.1 MPa,焊接膜材C50、T50的屈服强度分别为34.4 MPa、39.6 MPa.薄膜母材与焊接薄膜的抗拉强度及弹性模量基本一致.焊接温度影响TPI焊接膜材的屈服应力,不同焊接工艺对TPI焊接薄膜的抗拉强度及弹性模量无显著影响.