元器件再利用的废旧印制电路板拆解技术研究

摘要

In order to guarantee the reusability of the disassembled components,a non destruc-tive technology to disassemble waste printed circuit board (PCB)is proposed.According to the charac-teristics of waste PCB assembly and welding,a dis-mantling process including the technologies of solder heating welding,wind blowing separation and removal force is discussed.Sample experiments show that the proposed method improves compo-nents recycling and waste PCB dismantling.%将元器件从废旧 PCB 上无损拆卸，既可以实现元器件的回收再利用，易于处理含有有毒有害物质，又便于拆卸后的 PCB 实现贵重金属回收和非金属材料的再生利用。在总结国内外对废旧PCB 处理方法的基础上，根据电子产品中元器件组装与焊接特点，提出了能实现元器件重用的低成本无损拆解方案，分析讨论了钎料加热熔焊技术、风力吹扫分离技术和拆除力施加技术。试验表明，本方案实现了废旧 PCB 资源化拆解。