Progress on Soldering Failure Analysis During the Period of Enlistment in Micro-Nanoelectronic Packaging

摘要

With development of miniaturization,high integration,multifunction and high efficiency of electronic packaging technology,a higher requirement for soldering material and its enlistment property is needed.It is easily subjected to reliability failure for electronic products or components packaged with micro/nanoelectronic packaging technology.In this paper,research process and some typical failure mechanisms on interconnect solder point reliability are discussed,including electro-migration (EM),thermal migration (TM),K-cavity,corrosion,electrochemical migration (ECM) and whisker growth,etc.It provides the basic data for the new generation of micro/nano-packaging technique to improve the fine-pitch jointing reliability.