The buckling and post-buckling of clamped circular plate subjected to distributed radialcompressed load is presented by using the high-order perturbation analysis and shooting method.Thesixth-order solution shows good agreement with the FEM results in[11].The results in this paper areapplied to investisate the budding and growth of pressed thin film delamination in the film/substratesystem.Under a certain residual pressure in the thin film,two characteristic blister radii R_c and R_s,thecritical radius and growing radius respectively,are obtained.The numerical result shows that thegrowth criterion of delamination in [9,10] is not perfect.In variant residual stress or interface tough-hess,the conditions of no growth,stable growth and unstable growth of the delamination are obtainedby comparing the driving force at the interface crack tip with the interface toughness.
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