低温瓷粉、高温瓷粉与钴铬烤瓷合金结合强度的实验研究

摘要

Objective: To evaluate the bond strength of IPS d.SIGN low fusing porcelain and IPS Classic high fusing porcelain fussed to Wirobond(R) C New Formula Cobalt-chrome metal-to-ceramic alloy respectively.Methods: Low fusing porcelain and high fusing porcelain was fused to the Cobalt-Chromium alloys strips respectively according to ISO9693 ( n = 10/group).8 specimens of each group were submitted to three point bending test, the other two were observed by SEM.Results: The bond strength (MPa) of low fusing porcelain group and high fusing porcelain group was 29.82 ± 5.37 and 39.20 ± 4.68 respectively ( P ＜ 0.05 ), both were higher than 25 MPa required by ISO9693.SEM observation showed that IPS Classic and Wirobond(R) C Cobalt-chrome alloy combined together closely without cracks.Scattered bubbles with diameter of 2 - 4 μm, casually with diameter of 5 - 6 μm could be observed.The combination of IPS d.SIGN with the alloy was a little looser than that of IPS classic.The bubbles was a little more than those in the IPS Classic group.And the diameter varied from 2, 3 μm to 10 μm.Conclusion: Both IPS d.SIGN low fusing porcelain and IPS Classic high fusing porcelain can match with Wirobond(R) C New Formula Cobalt-chrome metal-to-ceramic alloy.%目的:观察IPS d.SIGN低温瓷粉、IPS Classic高温瓷粉与Wirobond C钴铬合金的金瓷结合强度及结合界面的微观形貌.方法:制作低温瓷粉、高温瓷粉与钴铬合金的金瓷结合试件各10 个,其中8 个进行三点弯曲测试,2个包埋打磨后用扫描电镜观察界面.结果:低温瓷粉组、高温瓷粉组的金瓷结合强度值分别是(29.82±5.37) MPa、(39.20±4.68) MPa(P＜0.05),均显著大于ISO9693要求的25 MPa.扫描电镜下可见低温瓷粉组比高温瓷粉组金瓷结合较为疏松,界面气泡略多,且大小差异更明显.结论:IPS d.SIGN低温瓷粉和IPS Classic高温瓷粉均可与Wirobond C钴铬烤瓷合金匹配使用.