添加剂和电流密度对镍钴合金电铸层组织结构的影响

摘要

研究了添加剂、电流密度对镍钴合金电铸层应力和钴含量的影响.采用SEM、能谱仪和X射线衍射分析了添加剂和电流密度对铸层形貌及微观结构的影响.结果表明:添加剂TN2能够使铸层产生压应力；TN3能够使铸层产生张应力,TN3与TN2配合使用,能够使铸层应力达到平衡值零.电流密度增加时,当电流密度小于6A/dm2时,铸层应力随之增加；当电流密度大于6A/dm2时,铸层应力随之减小.添加剂对铸层钴含量影响不明显而电流密度对铸层钴含量的影响较明显；TN2,TN3的加入能够使铸层更平滑、晶粒细致紧密.添加剂TN2对衍射峰(200)影响较大,对晶面具有一定的选择性；添加剂TN3对晶面具有较强的选择性,易在(200)面吸附,抑制其生长,此时晶体的生长方向主要为[100].随着电流密度的增大,衍射峰出现宽化的趋势.%The influences of additives and current density on the stress and cobalt content of nickel-cobalt alloy electroforming layer were studied.The effects of additives and current density to the morphology and microstructure of nickel-cobalt alloy electroforming layer were investigated by SEM,EDS and X-ray diffraction.The results showed that compressive stress was generated in the electroforming layer when the additive TN2 added in the electroforming solution; the additive TN3 could make tensile stress.So electroforming layer might have a balance of zero stress by adding TN2 and TN3 together.When the current density was less than 6A/dm2,the stress of electroforming layer increased along with the current density; when the current density was greater than 6A/dm2,the stress of electroforming layer decreased along with the current density.The additives' influence on the cobalt content of electroforming layer was not obvious.The current density's influence on the cobalt content of electroforming layer was more obvious.Smoother and finer grain could be acquired when the TN2 or TN3 added in the electroforming solution.The additive TN2 had a large effect on the diffraction peak(200) and certain selectivity to the crystal face.The additive TN3 had a strong selectivity to the crystal face,easily adsorbed on the (200) surfaces to inhibit their growth,so the crystal growth direction was mainly [100].With the current density increasing,the diffraction peak had the widening trend.