应用圆筒形行波压电振子的流体抛光实验研究

摘要

应用圆筒形行波压电振子设计了流体振动抛光装置。选取压电振子第十阶弯曲模态作为硅片抛光实验的工作模态，利用化学机械抛光浆料作为抛光液体，对不同表面形貌的硅片进行了抛光实验。实验结果表明硅片表面粗糙度得到改善。该方法也说明流体振动抛光更加适用于对已经具有较高表面平整度的抛光片进行二次抛光。%A type of polishing device using the vibration of liquid was designed on the basis of the cylindrical travelling wave piezoelectric vibrator. The 10th order bending mode was chosen as the working mode, the chemical-mechanical polishing slurry was used as the working liquid, and then the silicon wafers with different morphology were polished by this method. The experimental results indicate that the silicon wafers polished by this method have the better morphology. This result also indicates that the polishing method using vibration of liquid is more applicable to the second polishing of the silicon wafers, to the effect, with better surface flatness.