结合二维信息的PMP三维测量相位展开方法

摘要

In SMT solder paste deposit 3D measurement based on Phase Measurement Profilometry (PMP),shadow,noise and holes made the conventional phase unwrapping method unable to meet requirement.Considering practical engineering conditions,the phase unwrapping method was improved with 2D image information:the basic principle method was applied to smooth areas while the qualityguided unwrapping and least-square methods were employed in shadow areas,border areas and special solder for phase unwrapping respectively.Experimental results show that the proposed method can ensure the correct and quick unwrapping of desired phases.%在基于光栅投影相位测量轮廓术的电子贴片安装印刷锡膏质量三维检测中,阴影、噪声和在线检测的快速性要求都使传统相位展开方法不能满足需要.结合该应用的实际工程条件,根据二维图像信息,可以改进相位展开方法:在测量对象平滑的区域,用基本原理法进行相位展开；在阴影、边界区域和三维异常的情形,分别采用质量图导向法和最小二乘法进行相位展开.实验证明该方法既保证了PMP包裹相位的正确展开,又提高了处理速度.