采用乙烯作为碳源,利用化学气相沉积法(C V D法),在1000℃条件下在铜箔上制备了少层石墨烯;采用不引入PM M A和PDM S 等杂质的直接转移方法将石墨烯薄膜转移到Si/SiO2基底上,对石墨烯薄膜进行了表征。实验研究表明,减小乙烯的进气量可以提高石墨烯的质量;减少反应时间可以降低无定形碳的含量;增加退火时间可以提高Cu表面结晶质量,更加有利于石墨烯的生长。通过优化各项参数,使用乙烯已经可以制备 I2D/IG =08.8的少层石墨烯。%In this article ,we chose ethylene as the carbon source ,Cu as the catalyst ,we can manufacture few‐layer graphene in 1 000 ℃ ,with method of chemical vapor deposition (CVD) ,and then utilizing a simple direct transfer method without PMMA and PDMS assisted ,we can transfer the few‐layer graphene to the Si/SiO2 sub‐strate to characterize the graphene .From the experiments done in this article we can get the following results :reducing the amount of carbon source can improve quality of graphene;decreasing the reaction duration will cut dow n the content of the amorphous carbon ;increasing the annealing time can enhance the crystalline quality of the copper surface ,and also be more conductive to the grow th of graphene .In a conclusion ,through optimizing all the parameters ,we can ,using ethylene ,manufacture few‐layer grapheme whose I2D/IG was 0 8.8 .
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