首页> 中文期刊>功能材料 >Cu-Au-Ag三元去合金化制备纳米多孔金材料

Cu-Au-Ag三元去合金化制备纳米多孔金材料

     

摘要

The nanoporous gold film was synthesized by free corrosion dealloying Cu-Au-Ag precursor in the dissimilar acid solutions.The Cu, Au and Ag were prepared by magnetron sputter, respectively.The ternary Cu-Au-Ag precursor was an alloy of Cu, Au and Ag alloyed during the anneal process.Scanning electron microscope and energy dispersive analysis of X-ray are used to analyze the micro-structure and composition of the sample before and after dealloying.The results indicate that the Au3Ag28.5Cu68.5 alloy precursors formed at the condition of 400 ℃ heat-treatment for 36 h.The nanoporous Au/Ag sample was obtained after the selective corrosion in the FeCl3+ HCl solutions.The increase concentration of HNO3 is useful for preventing the surface cracking forming.The nanoporous gold samples with three-dimensional networks, ligament size of 10-35 nm, porosity of 84% were obtained.%采用磁控溅射镀铜金银多层膜,经过长时间高温热处理合金化制备前驱体三元合金,以不同的酸溶液自由腐蚀去合金化去除合金中的铜元素和银元素,成功制备出纳米多孔金薄膜.采用扫描电镜和X射线能谱仪对去合金腐蚀前后样品的形貌和成分进行了分析.结果表明,400 ℃,36 h热处理后铜金银多层膜完全合金化,获得了Au3Ag28.5Cu68.5合金材料;FeCl3+HCl溶液自由腐蚀去除铜可获得连续均匀的纳米尺寸孔隙结构,获得了几乎不含铜的样品;采用渐进浓度的硝酸自由腐蚀去合金化后去除银后获得了孔隙率约84%的纳米多孔金薄膜,其微观结构为连续的三维多孔结构,其系带尺寸10~35 nm,并且20~25 nm的系带分布达77%.

著录项

相似文献

  • 中文文献
  • 外文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号