The cure reaction and thermal properties of bismaleimides containing ether linkage were characterized by methods of differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). It shows that the cure reaction and thermal properties of BMPN are obviously different from those of BMPB and BMPA because of the existence of naphthalene in the structure of bismaleimide (BMI) resin forming BMPN. The cure reactive activation of - C=C- group in the structure of BMPN is lower than those in the structures of BMPB and BMPA because of stronger electro-attracting ability of naphthalene ring in BMPN, and the activation energy for cure reaction of BMPN (117.7 kJ·mol-1) is higher than those of BMPB and BMPA. The thermal and thermal-oxidative stabilities of BMPN are ameliorated obviously due to the introduction of naphthalene ring in its BMI resin, and the introduced naphthalene ring plays a more important role towards the thermal-oxidative stability than the thermal stability. The existence of aromatic ring leads to reduce the rates of thermal and thermal-oxidative decompositions during high temperature stage. Compared to BMP resin, introduction of naphthalene ring remedies the loss of thermal and thermal-oxidative stability caused by the introduction of ether linkage.%采用差示扫描量热法(DSC)和热失重法(TGA)详细研究了新型双马来酰亚胺(BMI)树脂体系的固化反应和耐热性能.研究结果表明,BMPN(2,7-二(4-马来酰亚胺)苯醚基萘)树脂由于萘环结构的存在,在固化反应及耐热性能方面与BMPB(1,4二(4-马来酰亚胺)苯醚基苯)、BMPA(4,4'-二(4-马来酰亚胺)苯醚基双酚)等BMI树脂有明显的不同.在固化反应方面,由于BMPN树脂结构中萘环具有较强的吸电子效应,其固化反应的活化能高达117.7 kJ·mol-1；在耐热性能方面,由于萘环的引入,BMPN树脂的耐热性能和耐热氧化性能明显得到改善,尤其是树脂的耐热氧化性能.同时,芳香环的存在还降低树脂体系高温阶段的热分解和热氧化分解的分解速率.和BMP树脂相比,在BMI树脂结构中引入醚键虽然在一定程度上降低了树脂的耐热性能,但萘环等芳香环的引入却可以弥补部分由于醚键的引入所造成耐热性能的损失.
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