Cu(Ⅱ)在谷氨酸根配合物体系中的电沉积行为

摘要

采用循环伏安法研究谷氨酸根配合物体系中谷氮酸根离子的稳定性和铜在阴极的电沉积过程,利用线性扫描伏安法求体系的表观活化能、表观传递系数和交换电流密度;计时电流法判断铜在电极上的成核方式.实验结果表明:在扫描电位-1.5～3 V内,谷氨酸钠溶液中仅有水的电解反应,谷氨酸根离子无氧化还原反应,铜在阴极沉秋时为不可逆过程;循环伏安曲线的感抗环说明铜在阴极沉积时经历了电结晶过程;由线性扫描伏安法求得表观活化能为34.065 kJ/mol,表观传递系数为0.360,电流交换密度为0.105 A/m2:铜在不锈钢电极上的成核方式为连续成核.%Copper electrodeposition behavior was studied in the system of glutamine (Gln).The stability of Gln in the system of Cu-Gln and copper electrodeposition on cathode were investigated by Cyclic Voltammogram(CV).Apparent activation energy, apparent transfer coefficient and exchange current density were obtained by linear sweep voltammogram(LSV).Nucleation mechanism of Cu deposition was determined by current-time-transient (CTT).The experimental results show that there is no other redox reaction but hydrolysis in the voltage arranging from -1.5 V to 3 V vs SCE, CV shows that copper experiences the process of nucleation and copper electrodeposition is completely inreversible.The apparent activation energy is calculated to be 34.065 k J/mol, apparent transfer coefficient is 0.360 and exchange current density is 0.105 A/m2.CTT measurement of Cu deposition exhibits potential-independent kinetics that is well described by progressive nucleation model.