金属薄膜晶体学结构对其电爆炸性能的影响

摘要

Four kinds of copper foils fabricated by different process are investigated by SEM and XRD, in order to study the relationships between the microstructure of copper films and their electric exploding properties. The influences of several factors on foil exploding properties are discussed, including film resistance, grain boundary resistance, the amount of grain boundary, grain size, grain orientation, etc., so the function of copper foil in slapper detonator can be realized from microstructure view.%采用SEM、XRD等手段对4种不同工艺制得的铜箔进行了表征,从微观晶体学结构的角度考察爆炸箔起爆器中桥膜的显微结构与其电爆炸性能的关系,讨论了薄膜电阻、晶界电阻、晶界数量、晶粒尺寸、晶粒取向等因素对金属薄膜电爆炸性能的影响,进而从微观层面上理解桥箔在冲击片雷管中的作用.