半导体制冷片对电子元件降温效果的试验研究

摘要

The electronic components cooling effect by semiconductor refrigeration was tested by experiment in the study. The temperature data were obtained under the experimental condition of the air - cooled heat exchanger and semiconductor refrigeration. The influence of the voltage of CPU and refrigeration piece on cooling effect was also analyzed. The results showed that the semiconductor refrigeration made a CPU temperature decline of 15 to 25 degrees, which can meet the temperature requirements of high frequency electronics, and found that the CPU cooling effect and voltage of refrigeration piece is not relation of certain direct ratio.%就半导体制冷器对CPU等电子元件的降温效果进行了试验研究.通过模拟试验分别得到了CPU在传统风冷散热装置和接入半导体制冷片时的温度数据,并对比分析了CPU输入电压以及制冷片电压对降温效果的影响.结果显示,接入半导体制冷片后,CPU的工作温度大为降低,降温幅度达到15～25℃,可以很好地满足高频电子元件的温度要求；同时发现CPU的降温效果与制冷片电压并不成正比关系.