基于MCM技术的X波段四通道T/R组件设计

摘要

T/R 组件作为雷达系统的最重要部件之一,它的性能直接影响了整个雷达系统的探测效果,T/R组件的小型化、低成本化将大幅度促进雷达系统的发展。本文采用LTCC基片、陶瓷基片等简单成熟工艺,利用高密度封装技术—多芯片组件( Multi-Chip Module,简称为MCM)技术实现了X波段T/R组件的设计。该封装设计具有集成度高、散热性好和可靠性高等特点,可应用于X波段二维有源相控阵T/R子阵的工程研制。%As one of the key parts of radar system, the performance of T/R module effects detecting result of radar system directly. The miniaturization and low cost of T/R module will greatly promote development of radar system. The design of X-band T/R module is implemented by using simple and mature techniques like LTCC and ceramic substrates and high density packaging ( MCM: multichip Module ) technology. The packaging design is featured with high integration, excellent heat dissipation and high reliability, which can be applied in research and develop-ment of T/R module of X-band 2 D active phased array.