Objective A thermal simulation analysis method based on temperature data measured from heating components in thermal balance test was proposed in allusion to inaccurate simulation analysis method for thermal design of electronic equipment in manned space flight application system.Methods After the in-depth analysis on electronic product's in-orbit thermal condition for space utilization, a thermal model was established by computer simulation software with the knowing of physical properties, electrical characters and technical features. The temperature simulation results of the heat generating com-ponents' shell were compared with their practical measured data from thermal balance test, and the accuracy of the thermal model was tested Results The thermal balance test was conducted on an electronic product under the condition that vacuum was 1.0×10-4Pa, and temperature was 45℃. The temperature difference between simulation and measured data was less than 1℃. In the heat balance test, when switching different working modes, the difference between the thermal load indexes calculated based on the working current and voltage of components and thermal consumption value obtained in simulation was less than 0.1 W.Conclusion According to data measured from heating components in thermal balance test, the thermal design method for electronic equipment of thermal simulation analysis is tested to be feasible and effective, and it is favorable for future thermal design on electronic product in space station utilization system.%目的 针对以往载人航天应用系统中电子设备热设计的仿真分析方法不准确的问题,提出一种基于热平衡试验测量发热元器件温度数据验证热仿真分析结果的电子设备热设计方法.方法 通过对应用系统电子设备在轨实际热工况条件的深入分析,结合电子设备的物理特性、电气特性及其技术特点,利用计算机应用技术和数字仿真技术建立电子设备热模型,并进行热仿真分析,再将仿真计算得到的发热元器件壳温与实际热平衡试验测量得到的元器件真实壳温比对,检验热仿真分析结果的准确性.结果 某电子设备在真空度为1.0×10-4 Pa,温度为45℃条件下开展热平衡试验,实测得到的发热元器件温度值与热仿真分析温度值之差小于1℃.热平衡试验过程中,切换电子设备的不同工作模式时,通过器件的工作电流和电压计算出其热负荷指标与仿真得到的热耗值之差低于0.1 W.结论 基于热平衡试验的发热元器件实测温度数据,验证了热仿真分析结果的电子设备热设计方法科学有效,有助于后续空间站应用系统电子设备热设计工作.
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