键合机芯片翻转机构及其动力学仿真

摘要

In the fine-out chip Bonding process, Bonding machine need redistribution for chip.Because of different manufacturing process.there are up or down conditions in the chip.this article analyzes the work process and development process for flip-chip Equipment.%在Fine-Out(扇出)芯片键合制程中需要对芯片(Die)进行重新布局,由于制造工艺的不同,芯片标记面可能存在向上或向下工况.介绍了芯片翻转机构的工作流程和设计开发过程.