激光加工中自动旋转校位切割的研究

摘要

Be aim to the last request of the consumers about improving the efficiency during the laser machining collate and incise on the surface of sapphire wafer, this article discuss and achieve the function which automatically collate and incise the wafer by automatically identify the image. This function has commendably improved the efficiency of dicing the wafer.%针对激光加工设备在Al2O3晶圆切割过程中的效率提高问题以及客户需求,通过图像识别功能,研究并设计实现晶圆的自动旋转校位与自动切割功能,极大地提高了晶圆切割效率。