首页> 中文期刊> 《工程塑料应用》 >废弃线路板中非金属材料再利用的研究进展

废弃线路板中非金属材料再利用的研究进展

         

摘要

The reusing of the non-metallic materials in the waste printed circuit board, especially the reusing of the thermosetting resins was reviewed. The grinding non-metallic materials to powder as a filler and used as modifier added to the thermosetting resins or thermoplastic resins to reduce the production costs or to improve the mechanical properties were summarized in detail. The application of the material used as a filler added to the high-quality building materials, such as enhanced asphalt, production of high strength, low-density reinforced concrete was discussed also. On the basis of various recyling methods, the rccyling trends of the nonmetallic materials in waste printed circuit board was discussed.%概述了废弃线路板中非金属材料主要是热固性塑料再利用的研究进展,主要针对非金属材料制成粉末作为填料或改性剂添加到热固性塑料、热塑性塑料中以降低塑料的生产成本或改善塑料的力学性能.或是将粉末作为高品质填料添加到建筑材料中,如增强沥青,生产高强、低密度的增强混凝土等的应用,在总结了各种回收再利用方法的基础上提出了未来废弃线路板中非金属材料再利用的发展趋势.

著录项

相似文献

  • 中文文献
  • 外文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号