首页> 中文期刊> 《电镀与环保》 >明胶对电沉积Sn-Co-C合金工艺的影响

明胶对电沉积Sn-Co-C合金工艺的影响

         

摘要

The effects of gelatin on the ternary alloy process and coating morphology in Sn-Co-C alloy electrodepositing system were investigated. The results show that when the mass concentration of gelatin is controlled in 1. 0 - 3. 0 g/L, a bright and smooth Sn-Co-C composite coating with good corrosion resistance can be obtained ; when the mass concentration is less than 1. 0 g/L, the coating is very rough and very unevenly covered on the substrate; and when its mass concentration is higher than 3. 0 g/L. The overall liquidity of the solution gets weaker and the coating loose, with a poorer corrosion resistance.%探讨了在电沉积Sn-Co-C合金工艺体系中,明胶时三无合金工艺及镀层形态的影响.结果表明;明胶的质量浓度控制在1.0~3.0 g/L时,能得到耐蚀性好且光亮平整的Sn-Co-C复合镀层;当其质量浓度低于1.0 g/L时,所得镀层非常粗糙且在基体上覆盖非常不均匀;当其质量浓度高于3.0 g/L时,溶液整体流动性变弱,镀层疏松,耐蚀性较差.

著录项

相似文献

  • 中文文献
  • 外文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号